Given that the equipment for the semiconductor packaging line adopts the fixed grouping production method, thus failing to dynamically match the processing task demand capacity, in the present study, we proposed a semiconductor bonding equipment-grouping method based on processing task matching. This method sets the device group closed position constraint and the matching constraint between the device type and the processing type and uses the graph theory method to establish the device grouping model. The dynamic grouping of equipment under the capacity demand of different processing tasks
